Customization: | Available |
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Chemical Composition: | Silicone Sealant |
Curing Time: | Fast Curing: Within 24 Hours |
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Before Curing *Extrusion rate tested with 3.18mm SEMCO nozzle,atmospheric pressure 0.30MPa *Note: curing rate varies with temperature, relative humidity, thickness of adhesive layer and presence of moisture. | Raw material | Polydimethylsilane |
Oxyane color | White/Black | |
Viscosity(cps@25℃) | Thixotropic paste | |
Curing speed (initial/full) | 5~15min./24hrs.(≥ 2mm) | |
Densities(g/cm3 )(GB/T13354) | 1.45~1.55 | |
Extrusion rate(g/min ,cps@25℃) | 28~80 | |
After Curing Sample approximately 2mm thickness cured for 14 days at a temperature of (23±2)°C and a relative humidity of (50±5)%RH, tested at (23± 2)°C | Operating temperature (℃) | -54 to 200 |
Hardness(Shore A)(ISO7619,GB/T531.1) | ≥45 | |
Elongation at rupture(%)(ISO37,GB/T528) | ≥200 | |
Tensile strength(MPa)(ISO37,GB/T528 | ≥2.0 | |
Shear strength (MPa,aluminum oxide anodized) (ISO4587,GB/T7124) | ≥1.0 | |
Damp heat aging performance (after aging at 85℃, 85% humidity for 1000h) | Elongation at rupture % (ISO37,GB/T528) | ≥ 20 |
Eensile strength( MPa (ISO37,GB/T528) | ≥1.5 | |
Electrical property | Volume resistivity (Ω•cm)(IEC60093,GB/T1692) | ≥0.5×1015 |
Breakdown strength (kV/mm) (IEC 60243-1, GB/ T1695) | ≥18 |